Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2009.11a
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- Pages.181-181
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- 2009
Studies on Properties with Different Filler and Content in Pb-free Sealing Frit for Electronic Devices
- Published : 2009.11.12
Abstract
전자부품용 Pb-free sealing frit의 열팽창계수를 기판에 matching 시키기 위하여 음의 열팽창계수를 가지고 있는