A numerical study on the residual stress in LED encapsulment silicone after curing and cooling

경화 및 냉각을 거친 LED 패키징 실리콘의 잔류응력에 대한 수치해석적 고찰

  • Song, M.J. ;
  • Kim, K.H. ;
  • Kang, J.J. ;
  • Kim, H.K.
  • 송민재 (한국생산기술연구원, 고려대학교 대학원) ;
  • 김권희 (고려대학교 기계공학부) ;
  • 강정진 (한국생산기술연구원 융합생산기술연구부) ;
  • 김흥규 (한국생산기술연구원 금형.성형기술연구부)
  • Published : 2009.05.07


Silicone is recently used for LED chip encapsulment due to its good thermal stability and optical transmittance. To mold a solid-state silicone encapsulment, curing by mixing at elevated temperatures followed by cooling is necessary. As the silicone molding process is involved in healing and subsequent cooling, the thermal residual stress, which causes mechanical warpage or optical birefringence in the final silicone encapsulment, may be induced if there are non-uniformities in cured silicone material properties or encapsulment shape design. The prediction of residual stress is necessary to design a high-quality silicone molding process. Therefore, in the present paper, a numerical parametric study was attempted to evaluate the heating and cooling effects on the thermal residual stress induced in the cured silicone.