$CH_4N_2S$와 $C_{10}H_{13}NO_3S$ 첨가가 Ni 패턴 상의 구리도금 형상에 미치는 영향

The copper plating was deposited by pulse reverse current (PRC) method with additives. The all specimens were first immersted in 10% H2SO4 for 10 minutes, and then were rinsed with deionized water. The current densities of forward pulse were 400mA/$cm^2$, and those of reverse pulse were 1900mA/$cm^2$ and 100mA/$cm^2$. Results are compared for different additives for pulse plating conditions. When it added in Only CH4N2S (TU) or only C10H13NO3S (SVH), the effect of surface side growth of Cu was not different. But when it added in TU and SVH, surface side growth of Cu decreased. Polarization curves were measured from OCP to -0.7 V at a rate of 1mV/sec. Each specimen was observed under the PHENOM to see surface morphology.