Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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A Study on Thermal Properties for Epoxy Micro-and-Nano Mixture Composites(EMNC)

에폭시 마이크로-나노 입자가 혼합된 콤포지트의 열적특성에 관한연구

  • Lee, Chang-Hoon (Department of Electric Electron Engineering, Joongbu University) ;
  • Kim, Kuk-Jin (Department of Electric Electron Engineering, Joongbu University) ;
  • Kim, Suk-Man (Department of Electric Electron Engineering, Joongbu University) ;
  • Kang, Do-Hoon (Department of Electric Electron Engineering, Joongbu University) ;
  • Yeon, Da-Som (Department of Electric Electron Engineering, Joongbu University) ;
  • Park, Jae-Jun (Department of Electric Electron Engineering, Joongbu University)
  • 이창훈 (중부대학교, 전기전자공학과) ;
  • 주국진 (중부대학교, 전기전자공학과) ;
  • 김석만 (중부대학교, 전기전자공학과) ;
  • 강도훈 (중부대학교, 전기전자공학과) ;
  • 연다솜 (중부대학교, 전기전자공학과) ;
  • 박재준 (중부대학교, 전기전자공학과)
  • Published : 2010.06.16
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Abstract

This study investigates the thermal and mechanical properties of insulation elements through mixing epoxy based micro- and nano particles. Regarding thermal properties, DSC and DMA were used to calculate crosslinking densities for various types of insulation elements. In a mechanical property of bending strength, shape and scale parameters were obtained using the Weibull plot. This study obtained the most excellent results of scale parameters, such as Vol 3.2%, in the bending strength of EMNCs.

Keywords

Acknowledgement

Supported by : KESRI, KETEP