The study on dry etching characteristics of ZnO thin films using high density plasma

고밀도 플라즈마를 이용한 ZnO 박막의 식각 특성

  • Heo, Keyong-Moo (Department of Renewable Energy, Chung-Ang university) ;
  • Woo, Jong-Chang (School of Electrical and Electronic Engineering, Chung-Ang university) ;
  • Kim, Chang-Il (School of Electrical and Electronic Engineering, Chung-Ang university)
  • 허경무 (중앙대학교 재생에너지 학과) ;
  • 우종창 (중앙대학교 전자전기공학부) ;
  • 김창일 (중앙대학교 전자전기공학부)
  • Published : 2010.06.16

Abstract

In this article, the dry etching mechanism of ZnO thin films in $N_2/Cl_2$/Ar gas chemistry was investigated. The ZnO thin films were deposited on Si substrate using Atomic layer deposition. The etching experiments were performed by inductively coupled plasma system. The maximum etch rate was104.5 nm/min and the highest selectivity of ZnO over $SiO_2$ was 3.3. Etching rate was measured by surface profiler. And the chemical reaction on the surface of the etched ZnO thin films was investigated by x-ray photo electrons pectroscopy. As a result of XPS, $Zn2p_{3/2}$ peak shifted toward a higher binding energy and the O-O and N-O bond were obtained from the sample of ZnO thin film which after plasma treatment.

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