Proceedings of the Korean Institute of Information and Commucation Sciences Conference (한국정보통신학회:학술대회논문집)
- 2011.10a
- /
- Pages.903-906
- /
- 2011
Thickness Control of Electroplating Layer for Copper Pillar Tin Bump
구리기둥범프 용 전해도금 층 제어
- Moon, Dae-Ho (Dept. of Electronic Eng., Myong-Ji University) ;
- Hong, Sang-Jeen (Dept. of Electronic Eng., Myong-Ji University) ;
- Park, Jong-Dae (Dept. of Electronic Eng., Myong-Ji University) ;
- Hwang, Jae-Ryong (ReSEAT Program, Korea Institute of Science & Technology Information) ;
- Soh, Dea-Wha (ReSEAT Program, Korea Institute of Science & Technology Information)
- 문대호 (명지대학교 전자공학과) ;
- 홍상진 (명지대학교 전자공학과) ;
- 박종대 (명지대학교 전자공학과) ;
- 황재룡 (한국과학기술정보연구원 ReSEAT 프로그램) ;
- 소대화 (한국과학기술정보연구원 ReSEAT 프로그램)
- Published : 2011.10.26
Abstract
The electroplating and electro-less plating methods have been applied for the high density chip interconnect of the Copper Pillar Tin Bump (CPTB) preparation. The CPTB was prepared, which had been electroplated about
고밀도집적을 위한 구리기둥주석범프(CPTB)의 제작공정에 흔히 전기도금과 무전해도금이 적용된다. CPTB는 약