Proceedings of the Korean Institute of Surface Engineering Conference (한국표면공학회:학술대회논문집)

The Korean Institute of Surface Engineering (한국표면공학회)
권호 표지

Effect of Surface Roughness, Thickness and Current Density on Surface Resistance of Electro-deposited Copper Layer

  • Kim, Y.M. (Department of Materials Science and Engineering, Dankook University) ;
  • Cho, S.K. (Department of Materials Science and Engineering, Dankook University) ;
  • Choi, Y. (Department of Materials Science and Engineering, Dankook University) ;
  • Lee, J.Y. (Korea Institute of Materials Science) ;
  • Kim, M. (Korea Institute of Materials Science)
  • Published : 2013.05.30
Download PDF
⟨ Previous Next ⟩

Abstract

Surface resistance of electro-deposited copper with its thickness, current density and surface roughness was determined by using a 4-point probe analyzer. The copper was prepared electrochemically on 316 stainless steel substrate in copper sulfate solution at the condition of $1A/dm^2$, 298 K, and 6.5 cm-electrode distance. The surface resistance of the copper sheet in the range of $0.93-0.97{\Omega}$ increased with the copper thickness in the range of $21-70{\mu}m$. The surface resistance in the range of $0.963-1.009{\Omega}$ also increased with current density in the range of $0.5-2A/dm^2$. The increased surface resistances corresponded to 11% for thickness and 25% for current density, respectively.

Keywords