한국표면공학회:학술대회논문집 (Proceedings of the Korean Institute of Surface Engineering Conference)

한국표면공학회 (The Korean Institute of Surface Engineering)
권호 표지

A novel approach to fabricate Cu-Ni core-shell microwires

  • Song, Chang-Hyun (Korea Electronics Technology Institute, Display Components and Materials Research Center) ;
  • Kim, Jong-Woong (Korea Electronics Technology Institute, Display Components and Materials Research Center)
  • 발행 : 2015.11.26
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초록

Metallic microwires are a promising material for use as a filler in various conductive composite structures. Because of their high anisotropy in shape, a low percolation threshold could be achieved, which is beneficial to a low-cost fabrication and better electrical conductivity even under an extremely low solid content. Here we developed a facile method to fabricate the Cu (core)-Ni (shell) microwires.

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