Effect of Deposition Conditions on Deposition Mechanism and Surface Morphology of TiO2 Thin Films Deposited by Chemical Vapor Deposition

화학증착법에 의해 성장된 TiO2박막의 증착기구와 표면형상에 미치는 증착조건의 영향

  • 황철성 (서울대학교 무기재료공학과) ;
  • 김형준 (서울대학교 무기재료공학과)
  • Published : 1989.04.01

Abstract

Polycrystalline TiO2 thin films were deposited on Si and Al2O3 substrates by CVD method. Ethyl titanate, Ti(OC2H5)4, was used as a source material for Ti and O, and Ar was used for carrier gas. In the surface chemical reaction controlled deposition condition, the apparent activation energy of 6.74 Kcal/mole was obtained, and the atomic adsorption on substrate surface was proved to be governed by Rideal-Elley mechanism. In the mass transfer controlled deposition condition, the deposition rate was in a good agreement with the result which was calculated by the simple boundary layer theory. It was also observed that TiO2 thin films show different surface morphology according to the different deposition mechanism, which was fixed by deposition conditions. This phenomenon could be well explained by the surface perturbation theory.

Keywords

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