The Effects of Process parameters on TiN Films deposited by Ion Plating Technique

이온 플레이팅의 TiN코팅층에 미치는 작업인자의 영향

  • 백응승 (한국기계연구소 표면처리 연구소) ;
  • 권식철 (한국기계연구소 표면처리 연구소) ;
  • 이상로 (한국기계연구소 표면처리 연구소) ;
  • 이건환 (한국기계연구소 표면처리 연구소)
  • Published : 1990.06.01

Abstract

The TiN filmms were deposited on the stainless steel substrates by BARE techinique in order to investigate the effects of process parameters such as source-to-substate distance (15-35cm), N2 pressure(4$\times$10-10 -1$\times$10-3mb)and bias voltage(O-2000V), on the deposition rate, the concentration ratio [N/Ti] and the surface color of the films. The deposition rate was deduced from the weight measurement, the [N/ti] ratio by ESCA. The deposition rate decreased with a relationship of=40.2/D2 where D was source-to-substrate distance. The effect of the bias voltage and the N2pressure on the deposition rate, however, appeared negligble. The [N/Ti] ratio was in the narrow range of 0.7 tp 0.8 It increased slightly with the N2 partial pressure and deceased with the source-to-substrate distance. It was confired by ESCA that a significant amount of oxygen and carbon was contaminated after deposition in the top surface of TiN films. The surface color of TiN film was changed from light gold yellow to reddish gold yellow with increasing [N/Ti] ratio.

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