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Boiling Heat Transfer from a locally Heated Surface -A Simulated Electronic Device under Liquid Immersion Cooling-

국부적인 발열부분을 가진 표면에서의 잠김 비등열전달 -전자부품 액침 냉각에서의 응용-


Abstract

The pool boiling behavior of a heated surface has been investigated experimentally, focusing on the cases when only a part of the contact surface is heated. Characteristic boiling curves are obtained with circular metal surface test pieces heated below while immersed in Refrigerant-113. Locally heated test pieces are fabricated by inserting a heating block at the center inside a larger conducting block. Overall heat transfer rates are measured while the experimental conditions are systematically varied. The local temperature profiles along the radius are measured for conducting blocks. It is found that the conjugated boiling condition exists and the total heat fluxes should be correlated to a suitably defined temperature difference.

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