Study on Bond Used in Shoes Manufacturing Industry

신발제조업체에서 사용되는 접착제에 관한 연구

  • Park, D.H. (Dept. of Prev. Med, Coll, of Med. and Inst, of Ind, Med, Inje University) ;
  • Moon, D.H. (Dept. of Prev. Med, Coll, of Med. and Inst, of Ind, Med, Inje University) ;
  • Lee, C.U. (Dept. of Prev. Med, Coll, of Med. and Inst, of Ind, Med, Inje University)
  • 박대희 (인재대학교 의과대학 예방의학교실 및 산업의 학연구소) ;
  • 문덕환 (인재대학교 의과대학 예방의학교실 및 산업의 학연구소) ;
  • 이채언 (인재대학교 의과대학 예방의학교실 및 산업의 학연구소)
  • Published : 1991.11.30

Abstract

ln order to acquire the fundamental data for the organic solvents in bond and to contribute the health improvement of workers in deprtment of organic solvents in shoes manufacturing industries. The authors surveyed the contents of organic solvent in adhesive and determined the amount of volatilization of organic solvent by time and temperature with gaschromatography from March to September 1990. The results were as follows; 1) The kinds for organic solvents in bond were 9 that was Toluene, C-Hexane, N-Hexane, C-Hexanon, Aceton, Methyl Ethyl Keton, Dimethyl Formamide, Etyly Acetate. 2) Toluene and Methyl Ethyl Keton among the organic solvents in adhesive were over 80.18%. 3) The amount of volatilization of Methyl Cyclohexanone and Aceton by time and temperature were the most level than other compounds.

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