A micridefects determination method of the interface by ultrasonic testing image processing

초음파탐상 화상에 의한 이종재 경계면의 미소결함 결정법

Recently, it is gradually raised necessity that interface is measured accurately and managed in industrial circle and medical world. An Ultrasonic wave transmitted from a focused beam tranducer is being expected as a powerful tool for NDE of the delamination. The Ultrasonic NDE of the delamination is based on the form of the wave reflected from the interface. In this study results, automatically repeated discrimination analysis method can be devided in the category of all kinds of defects on semiconductor package, and also can be possible to have a sampling of partial delamination.