Journal of the Korean Institute of Telematics and Electronics A (전자공학회논문지A)

The Institute of Electronics and Information Engineers (대한전자공학회)
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Characteristics of the aluminum thisn films for the prevention of copper oxidation

구리 금속선의 산화 방지를 위한 알루미늄 박막의 산화 방지 특성

  • 이경일 (금성일렉트론㈜ 반도체연구소) ;
  • 민경익 (서울대학교 대학원 금속공학과) ;
  • 주승기 (서울대학교 대학원 금속공학과) ;
  • 라관구 (금성일렉트론㈜ 반도체연구소) ;
  • 김우식 (금성일렉트론㈜ 반도체연구소)
  • Published : 1994.10.01
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Abstract

The characteristics of the oxidation prevention layers for the copper metallization were investigated. The thin films such as Cr, TiN and Al were used as the oxidation prevention layers for copper. Ultra thin aluminum films were found to prevent the oxidation of copper up to the highest oxidation annealing temperature among the barrier layers examined in this study. It was found that oxygen did not diffuse into copper through aluminum films because of the aluminum oxide layer formed on the aluminum surface and the ultra thin aluminum film could be a good oxidation barrier layer for the copper metallization.

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