Journal of the Korean Institute of Telematics and Electronics A (전자공학회논문지A)

The Institute of Electronics and Information Engineers (대한전자공학회)
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A Study on the Fatigue Life Prediction of Solder Joints under Thermal Cyclic Loading

온도사이클을 받는 Solder Joint의 피로수명에 관한 연구

  • 김진기 (한국과학기술원 기계공학과) ;
  • 이순복 (한국과학기술원 기계공학과)
  • Published : 1994.12.01
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Abstract

This study is to apply the theory of fatigue fracture to solder joints under thermal cyclic loading and predict life of solder joint to failure. A 62Sn-36Pb-2Ag solder was used in this study. Tensile tests were preformed at temperatures of 15.dec. C, 50.dec. C and 85.dec. C in order to find terms of crack length "a". plastic strain range ""${\Delta}{\varepsilon}_p$" and temperature "T". Solder joint under thermal cyclic loading was analyzed by FEM. this FEM analysis together with the crack growth rate will provide the capability of the fatigue life prediction of solder joints and enhance the reliability od solder joint.

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