A study on the fault analysis of CMOS logic circuit using IDDQ testing technique

IDDQ 테스트 방식을 이용한 CMOS 논리회로의 고장분석에 관한 연구

This paper analyzes the faults and their mechanism of CMOS ICs using IDDQ testing technique and evalutes the reliability of the chips that fail this test. It is implemented by the three testing phases, initial test, burn-in and life test. Each testing phase includes the parametric test, functional test, IDDQ test and propagation delay test. It is shown that the short faults such as gate-oxide short, bridging can be only detected by IDDQ testing technique and the number of test patterns for this test technique is very few. After first burn-in, the IDDQ of some test chips is decreased, which is increased in conventional studies and in subsequent burn-in, the IDDQ of all test chips is stabilized. It is verified that the resistive short faults exist in the test chips and it is deteriorated with time and causes the logic fault. Also, the new testing technique which can easily detect the rsistive short fault is proposed.