DGEBA-MDA-SN-Hydroxyl Group System and Composites -Cure Kinetics and Mechanism in DGEBA/MDA/SN/HQ System-

DGEBA-MDA-SN-Hydroxyl계 복합재료의 제조 -DGEBA-MDA-SN-HQ계의 경화반응 속도론 및 메카니즘-

The effects of cure kinetics and mechanism of DGEBA(diglycidyl ether of bisphenol A)/MDA(4,4'-methylene dianiline) with SN(succinonitrile) and HQ(hydroquinone) as an additive and accelerator were investigated. Cure kinetics was evaluated by Kissinger equation and fractional-life method through DSC analysis. The activation energy has hydroxyl group as an accelerator, the activation energy and the starting cure-temperature were lower than those of DGEBA/MDA/SN system. Cure mechanism of those systems was investigated through FT-IR according to the various SN contents. The ratio was SN : HQ = 4 : 1. It has been known that the cure reactions of an epoxy-diamine system are composed of primary amine-epoxy reaction, secondary amino-epoxy reaction and epoxy-hydroxyl group reaction. But in DGEBA/MDA/SN system, primary amino-CN group reaction and CN group-hydroxyl group reaction were added to the above mentioned reactions. These reactions attributed to the long main chain and the low crossliking density. And in DGEBA/MDA/SN/HQ system, hydroxyl group of HQ formed a transition state with epoxide group and amime group and also opened the ring of the epoxide group rapidly, then amino-epoxy reaction took place easily.

DGEBA(diglycidyl ether of bisphenol A)/MDA(4,4'-methylene dianiline)/SN(succinonitrile)/HQ(hydroquinone)계의 경화반응 속도론 및 메카니즘을 연구하였다. SN과 HQ는 반응성 첨가제와 촉매로 도입하였다. 경화반응 속도론은 DSC 분석에 의해 Kissinger equation과 fractional-life법을 이용하여 연구하였다. DGEBA/MDA/SN 계의 활성화에너지와 반응차수는 SN의 함량에 관계없이 거의 일정하였고, 촉매로써 HQ가 첨가됨으로 인해 활성화 에너지와 반응시작온도가 낮아졌다. 이들 계의 반응 메카니즘을 고찰하기위하여 SN의 함량에 따라 FT-IR을 측정하였다. 그리고, SN:HQ의 혼합비는 4:1이었다. Diamine으로 경화되는 에폭시 수지의 경화반응 메카니즘은 primary amine-epoxy 반응, secondary amine-epoxy 반응, epoxy-hydroxyl 반응이 일어나는 것으로 알려져 있다. DGEBA/MDA/SN/HQ 계에서는 HQ의 hydroxyl 기가 epoxy 및 amine과 결합하여 전이상태를 형성하여 epoxide ring을 빠르게 개환시켜줌으로써 amine-epoxy반응이 쉽게 일어남을 알았다.