참고문헌
- J. Solid-State Circ. v.SC-9 no.5 Design of ion-implanted MOSFET's with very small physical dimensions Dennard, R.H.;Gaensslen, F.H.;Yu, H.N.;Rideout, V.L.;Bassous, E.;LeBlanc, A.R.
- Microelectronics and Reliability v.37 Scaling down and reliability problems of gigabit CMOS circuits Krautschneider, W.H.;Kohlhase, A.;Terletzki, H.
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IEEE Electron Device Lett.
v.42
Short channel effect suppressed sub-0.1-
${\mu}m$ grooved-gate MOSFET's with W gate Kimura, S.;Tanaka, J.;Noda, H.;Toyabe, T.;Ihara, S. - IEEE Trans. Electron Devices v.43 no.8 Short-channel effect immunity and current capability of sub-0.1-micron MOSFET's using a recessed channel Bricout, P.H.;Dubois, E
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Tech. Dig. IEEE Int's Electron Devices Meeting
A 0.1
${\mu}m$ -gate elevated source and drain MOSFET fabricated by phase-shifted lithography Kimura, S.;Noda, H.;Hisamoto, D.;Takeda, E. -
Tech. Dig. IEEE Int'l Electron Devices Meeting
Threshold voltage controlled 0.1-
${\mu}m$ MOSFET utilizing inversion layer as extreme shallow source/drain Noda, H.;Murai, F.;Kimura, S. -
Symp. on VLSI Tech.
High performance 0.1-
${\mu}m$ room temperature Si MOSFET's Yan, R.H.;Lee, K.F.;Jeon, D.J.;Kim, Y.O.;Park, B.G.;Pinto, M.R.;Rafferty, C.S.;Tennant, D.M.;Westerwick, E.H.;Chin, G.M.;Morris, M.C.;Early, K.;Mulgrew, P.;Mansfield, W.M.;Watts, R.K.;Vashchenkov, A.M.;Swartz, R.G.;Ourmazd, A. - Symp. on VLSI Technology The use of rapid thermal processing to improve performance of sub- half micron CMOS with and without salicide Chapman, R.A.;Rodder, M.;Moslehi, M.M.;Velo, L.;Kuehne, J.W.;Lane, A.P.
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Tech. Dig. IEEE Int'l Electron Device Meeting
A 0.05
${\mu}m$ CMOS with ultra shallow source/drain junctions fabricated by 5 keV ion implantation and rapid thermal annealing Hori, A.;Nakaoka, H.;Umimoto, H.;Yamashita, K.;Takase, M.;Shimizu, N.;Mizuno, B.;Odanaka, S. - Tech. Dig. IEEE Int'l Electron Device Meeting Sub-50 nm gate length N-MOSFETS with 10 nm phosphorous source and drain junctions Ono, M.;Saito, M.;Yoshitomi, T.;Fiegna, C.;Ohguro, T.;Iwai, H.
- Symp. on VLSI Tech. Novel deep sub-quarter micron PMOSFETs with ultra-shallow junctions utilizing boron diffusion from poly-Si/Oxide (BDSOX) Togo, M.;Mogami, T.;Uwasawa, K.;Kunio, T.
- IEEE Trans. Electron Devices v.43 no.7 A self-aligned counter-doped well process utilizing channel ion implantation Nakamura, H.;Horiuchi, T.
- Electronics Lett. v.33 no.5 CMOS device with self-aligned source/drain using amorphous silicon local interconnection layer Yoon, Y.S.;Baek, K.H.;Nam, K.S.
- IEEE Trans. Electron Devices v.43 no.3 Characteristics of buried-channel pMOS devices with shallow counter-doped layers fabricated using channel preamorphization Miyake, M.;Okazaki, Y.;Kobayashi, T.