An analysis of crosstalk in hihg-speed packaging interconnects using the finite difference time domain method

시간 영역 유한 차분법을 이용한 고속 패키지 접속 선로의 누화 해석

  • 남상식 (한국전자통신연구원 교환기술연구단) ;
  • 장상건 (단국대학교 공과대학 전자컴퓨터공학부) ;
  • 진연강 (단국대학교 공과대학 전자컴퓨터공학부)
  • Published : 1997.09.01

Abstract

In this paper, we analyzed the frequency characteristics and the crosstalk of the adjacent parallel lines and the crossed lines in high-speed packaging interconnections by using the three-dimensional finite difference time domain (3D FDTD) method. To analyze the actual crosstalk phenomena in the transmission of the high-speed digital sgnal, the step pulse with fast rise time was used for the source excitation signal instead of using the Gaussian pulse that is generally used in FDTD. To veify the theoretical resutls, the experimental interconnection lines that were fabricated on the Duroid substrate($\varepsilon_{r}$=2.33, h=0.787 [mm]) were tested by TDR(time domain reflectometry). The results show good agreement between the analyzed results and the tested outcomes.

본 논문에서는 3 차원 시간 영역 유한 차분법 (FDTD)을 이용하여 고속 패키지 접속 선로 구조들 중에서 인접 선로와 교차된 선로 구조에 대한 주파수 특성과 누화를 해석하였다. 고속 디지털 신호 전송에서의 실질적인 누화해석을 위하여 입력 여기 신호로서 시간 영역 유한 차분법에서 주로 사용되는 가우스 펄스 대신 빠른 상승 시간을 갖는 계단 펄스를 사용하였다. 해석 결과와 각 접속 선로 구조를 비유전율이 2.33이고, 높이가 0.787[mm]인 Duroid 기판에 제작, 시간 영역 반사측정기(TDR : time domain reflectometry)로 측정한 결과가 잘 일치함을 보였다.

Keywords

References

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