Abstract
Poly-$Si_{1-x}Ge_x$ films on oxidized Si wafer were prepared by rapid thermal chemical vapor deposition using the $SiH_4$ and $GeH_4$ gaseous mixture at various deposition conditions. The deposition temperature, $SiH_4\;: GeH_4$ flow ratio and pressure were varied from 400 to $600^{\circ}C$, 1 : 0.1-2 : 1 and 1 to 50 torr, respectively. In this work, we have investigated the change of Ge composition of poly-$Si_{1-x}Ge_x$ films deposited with the variation of deposition parameters and the effect of Ge composition on the deposition rate. From the experimental results, it was observed that the deposition rate increased with increasing deposition temperature and Ge composition. On the other hand, the Ge composition decreased with increasing temperature. As the deposition pressure increased, the deposition rate and Ge composition were increased linearly to 10 torr but increased slowly above it, which has been attributed to the slower rate of surface reaction than mass transfer.
RTCVD법으로 $SiH_4$과 $GeH_4$ 가스를 이용하여 oxidized Si 위에 SiH$_4$: $GeH_4$ flow ratio(1 : 0.1~2 : 1), 증착온도(400~$600^{\circ}C$) 그리고 증착압력(1~50 torr)인 조건에서 다결정 $Si_{1-x}Ge_x$박막을 증착하여, 증착변수 변화에따른 $Si_{1-x}Ge_x$ 박막의 Ge 조성 변화와, Ge 조성이 증착속도에 미치는 영향 등에 대해 살펴보았다. 실험결과, 증착온도와 Ge 조성 증가에따라 증착속도는 증가하였으나 증착온도 증가에따라 Ge 조성이 감소하였다. 또한 증착압력 변화에따른 증착속도와 Ge조성 변화는, 증착압력 10 torr까지는 거의 직선적으로 증가하였으나 그이상에서는 서서히 증가함을 알 수 있었다. 이와같이 10 torr 이상의 증착압력에서 증착속도가 서서히 증가하는것은 물질전달 속도에 비해 표면반응 속도가 늦어져 나타난 현상으로 생각된다.