EFFECT OF SOLDERING CONDITION ON THE TENSILE STRENGTH OF TITANIUM SOLDER JOINT WITH 14K GOLD SOLDER

납착조건이 14K 금납을 이용한 티타늄 납착부의 인장강도에 미치는 영향

  • Choi, Jeoung-Ho (Dept. of Prosthodontics, Dept. of Dental Materials, and Institute of Dental Science, School of Dentistry, Chonbuk National University) ;
  • Kim, Tae-Jo (Dept. of Prosthodontics, Dept. of Dental Materials, and Institute of Dental Science, School of Dentistry, Chonbuk National University) ;
  • Song, Kwang-Yeob (Dept. of Prosthodontics, Dept. of Dental Materials, and Institute of Dental Science, School of Dentistry, Chonbuk National University) ;
  • Park, Charn-Woon (Dept. of Prosthodontics, Dept. of Dental Materials, and Institute of Dental Science, School of Dentistry, Chonbuk National University)
  • 최정호 (전북대학교 치과대학 보철학 교실 및 치의학 연구소) ;
  • 김태조 (전북대학교 치과대학 보철학 교실 및 치의학 연구소) ;
  • 송광엽 (전북대학교 치과대학 보철학 교실 및 치의학 연구소) ;
  • 박찬운 (전북대학교 치과대학 보철학 교실 및 치의학 연구소)
  • Published : 1997.11.01

Abstract

This study was performed to evaluate the tensile strength of solder joint in titanium and the wettability of 14K gold solder on titanium. Two pieces of titanium rod 30 mm in length and 3mm in diameter were butt-soldered with a 14K gold solder using the electric resistance heating under flux-argon atmosphere, the infrared heating under argon atmosphere, and the infrared heating under vacuum-argon atmosphere. A tensile test was performed at a crosshead speed of 0.5 mm/min, and fracture surfaces were examined by SEM. To evaluate the wettability of 14K gold solder on titanium, titanum plates of a $17{\times}17{\times}1mm$ were polished with #80-#2000 emery papers, and the spreading areas of solder 10 mg were measured by heating at 840 * for 60 seconds. The solder-matrix interface regions were etched by the solution of 10% KCN-10% (NH4)2S2O8, and analyzed by EPMA. The results obtained were summarized as follows ; 1. The maximum tensile strength was obtained when the titanium surface was polished with #2000 emery paper and soldered using the electric resistance heating under flux-argon atmosphere. Soldering strengths showed the significant difference between the electric resistance heating and the infrared heating(p<0.05). 3. The fracture surfaces showed the aspect of brittle fracture, and the failure developed along the interfaces of solder-matrix reaction zone. 4. The EPMA data for the solder-matrix interface region revealed that the diffusion of Au and Cu occurred to the titanium matrix, and the reaction zone showed the higher contents of Au, Cu and Ti than others.

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