Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Effects of Wicking on Solder Joint Profile in Gullwing Lead

워킹이 Gullwing 리드의 솔더 접합부 형상에 미치는 영향

  • 최동필 (한국과학기술원 자동화 및 설계공학과) ;
  • 유중돈 (한국과학기술원 자동화 및 설계공학과) ;
  • 이태수 (서강대학교 기계공학과) ;
  • 최상균 (영남대학교 기계공학과)
  • Published : 1998.08.01
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Abstract

During the reflow process in SMT, the molten solder has been observed to move upward and solidify along the gullwing lead, which is called the wicking phenomenon. In this paper, possible causes of the wicking are investigated, and its effects on the solder joint profile are quantitatively estimated by introducing the wicking constant. The free energy reduction by intermetallic formation between the copper and tin seems to be the major source of wicking action. The joint profiles of the gullwing lead are calculated using the previous finite element formulation incorporated with the wicking constant. The calculated results show reasonably good agreements with the experimental data when the wicking effects are considered.

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References

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