Study on oxygen precipitation behavior in Si wafers

실리콘 웨이퍼에서의 산소석출 거동 해석

  • Published : 1999.02.01

Abstract

The behavior of oxygen precipitation was investigated in radial direction using Si wafers with different vacancy-related defects generation area. The behavior of oxygen precipitation in radial direction is strongly dependent on the size of vacancy rich area which is related with crystal growth condition. Oxygen precipitation rate is more enhanced in vacancy rich area than that of interstitial rich area. And anomalous oxygen precipitation is generated in the marginal bands of vacancy and interstial area. In V/I boundary, however, oxygen precipitation is suppressed to nearly perfect.

결정성장 조건을 달리하여 공공관련 결함들의 발생영역의 크기가 다르게 형성되도록 성장한 실리콘 결정에서 반경 방향의 산소석출 거동을 고찰하였다. 반경 방향의 산소석출 거동은 결정성장 조건에 따른 공공 영역의 크기에 의존적이다. 반경 방향의 산소석출 거동은 공공우세 영역이 격자간원자 우세영역보다 산소석출이 증가한다. 또한 공공우세 영역과 격자간원자 우세영역 가장자리에서는 비정상적으로 산소석출이 크게 증가한다. 이 두 영역 경계에서는 산소석출이 거의 일어나지 않는다.

Keywords

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