Effect of High Filler Loading on the Reliability of Epoxy Holding Compound for Microelectronic Packaging

반도체 패키지 봉지재용 에폭시 수지 조성물의 신뢰특성에 미치는 실리카 고충전 영향

  • 정호용 (고려대학교 재료공학과) ;
  • 문경식 (고려대학교 재료공학과) ;
  • 최경세 (제일모직(주) 전자재료사업부)
  • Published : 1999.09.01

Abstract

The effects of high filler loading technique on the reliability of epoxy molding compound (EMC) as a microelectronic encapsulant was investigated. The method of high filler loading was established by the improvement of maximum packing fraction using the simplified packing model proposed by Ouchiyama, et al. With the maximum packing fraction of filler, the viscosity of EMC wart lowered and the flowability was improved. As the amount of filler in EMC increased, several properties such as internal stress and moisture absorption were improved. However, the adhesive strength with the alloy 42 leadframe decreased when the filler content was beyond the critical value. It was found that the appropriate content of filler was important to improve the reilability of EMC, and the optimum filler combination should be selected to obtain high reliable EMC filled with high volume fraction of filler.

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