Korean Journal of Materials Research (한국재료학회지)
- Volume 9 Issue 12
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- Pages.1176-1180
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- 1999
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- 1225-0562(pISSN)
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- 2287-7258(eISSN)
A Study on the Effect of Polyetherimide Surface Treatment on the Adhesion and High Temperature/High Humidity Reliability of MCM-D Interface
Polyetherimide 접착제의 표면 처리에 따른 MCM-D 계면 접착력 및 고온고습 신뢰성 변화에 관한 연구
- Yoon, Hyun-Gook (Korea Advanced Institute of Science and Technology, Department of Materials Science and Engineering) ;
- Ko, Hyoung-Soo (Korea Advanced Institute of Science and Technology, Department of Materials Science and Engineering) ;
- Paik, Kyung-Wook (Korea Advanced Institute of Science and Technology, Department of Materials Science and Engineering)
- Published : 1999.12.01
Abstract
The adhesion strength and high temperature/high humidity reliability of polyetherimide (PEI) adhesive on silicon wafer after being treated by each reactive ion etching (RIE) Aluminum (Al)-chelate adhesion promoter were investigated. 180
Polyetherimide와 실리콘 사이의 RIE 처리 및 알루미늄 킬레이트 계열의 adhesion promoter 처리에 따른 접착력과 고온고습환경에서의 신뢰성 변화를 연구하였다. 실험 방법으로는 180
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