Die-sinking Electrical Discharge Machining with Ultrasonic Emission for Ceramic Matrix Composite

초음파 진동 부가에 의한 세라믹 복합체의 형조방전가공

  • 왕덕현 (경기대 기계자동화공학부) ;
  • 우정윤 (경남대 대학원 기계공학부) ;
  • 윤존도 (경남대 신소재공학부)
  • Published : 1999.01.01

Abstract

Die-sinking electrical discharge machining(EDM) for conductive ceramic matrix composite(CMC) of Tic/$Al_2O_3$ was experienced with addition of ultrasonic emission, and the results were compared with ones obtained by the EDM only. From this experimental study, the values of material removal rate(MRR) and surface roughness($R_{max}$), scanning electron microscope(SEM) micrographs, and weibull probability distribution of bending strength for the specimens were obtained and compared. The trend of MRR was found to be increased slightly with the current and the duty factor for both EDM only and EDM with ultrasonic emission. The MRR values were found to be increased for EDM with ultrasonic emission. The SEM micrographs of EDMed surface by under various operating conditions showed less micro cracks in various places. Although smaller bending strength value was obtained by EDMed surface with ultrasonic emission by weibull probability distribution analysis of bending strength.

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