A New Cure Kinetic Model Using Dynamic Differential Scanning Calorimetry

일정온도 상승률 열분석법을 이용한 수지 경화 모델 개발

In general, manufacturing processes of thermosetting composites consist of mold filling and resin cure. The important parameters used in modeling and designing mold filling are the permeability of the fibrous preform and the viscosity of the resin. To consolidate a composite, resin cure or chemical reaction plays an essential role. Cure kinetics. Therefore, is necessary to quantify the extent of chemical reaction or degree of cure. It is also important to predict resin viscosity which can change due to chemical reaction during mold filling. There exists a heat transfer between the mold and the composite during mold filling and resin cure. Cure kinetics is also used to predict a temperature profile inside composite. In this study, a new scheme which can determine cure kinetics from dynamic temperature scaning was proposed. The method was applied to epoxy resin system and was verified by comparing measurements and predictions.