Journal of Welding and Joining

  • 제18권6호
  • /
  • Pages.74-82
  • /
  • 2000
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  • 2466-2232(pISSN)
  • /
  • 2466-2100(eISSN)
대한용접접합학회 (The Korean Welding and Joining Society)
권호 표지

UBM이 단면 증착된 Si-Wafer에 대한 Pb-free 솔더의 무플럭스 젖음 특성

The Fluxless Wetting Properties of UBM-Coated Si-Wafer to the Pb-Free Solders

  • 홍순민 (서울대학교 재료공학부) ;
  • 박재용 (서울대학교 재료공학부) ;
  • 김문일 (서울시립대학교 재료공학과) ;
  • 정재필 (서울시립대학교 재료공학과) ;
  • 강춘식 (서울대학교 재교공학부)
  • 발행 : 2000.12.01
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초록

The fluxless wetting properties of UBM-coated Si-wafer to the binary lead-free solders(Sn-Ag, Sn-Sb, Sjn-In, Sn0Bi) were estimated by wetting balance method. With the new wettability indices from the wetting curves of one side coated specimen, the wetting property estimation of UBM-coated Si-wafer was possible. For UBM of Si-chip, Au/Cu/Cr UBm was better than au/Ni/TI in the point of wetting time/ At general reflow process temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) was better than that of low melting point one(Sn-Bi, Sn-In). The contact angle of the one side coated Si-plate to the solder could be calculated from the force balance equation by measuring the static state force and the tilt angle.

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참고문헌

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