Journal of the Korean Society of Manufacturing Technology Engineers (한국생산제조학회지)

The Korean Society of Manufacturing Technology Engineers (한국생산제조학회)
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A Study on the Fracture behavior in Silicon Wafer using the Ultra-Precision Micro Positioning System

초미세 위치결정시스템을 이용한 실리콘 웨이퍼의 파괴거동에 관한 연구

  • Published : 2000.02.01
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Abstract

The background of this study lies in he investigation of the formation mechanism of ductile mode(nkanometer-size) chips of brittle materials such as fine ceramics glass and silicon. As the first step to achieve this purpose this paper intends to observe the micro-deformation behavior of these materials in sub${\mu}{\textrm}{m}$ depth indentation tests using a diamond indentor. In this study it was developed Ultra-Micro Indentation. Device using the PZT actuator. Experimentally by using the Ultra-Micro Indentation device the micro fracture behavior of the silicon wafer was investigated. It was possible that ductile-brittle transition point in ultimate surface of brittle material can be detected by adding an acoustic emission sensor system to the Ultra-Micro Indentation appartus.

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References

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