Nanoindentation experiments on some thin films on silicon

Nanoindentation 방법에 의한 박막의 경도 및 탄성계수 측정

  • Published : 2000.06.01

Abstract

The hardness and elastic modulus of three bulk materials are computed from the load and displacement data which are measured during basic nanoindentation test and compared with values determined by independent means to assess the accuracy of the method. The results show that with this technique, modulus and hardness and elastic modulus profile through depth of silicon nitride and silicon oxynitride films. The results show that for silicon nitride film deposited on silicon, hardness and elastic modulus increase as the volume ratio of NH3 : SiH4, which had been used for deposition, increases up to 20.0; and for silicon oxynitride film on silicon, the hardness and elastic modulus profile changes distinctly as the relative amount of oxygen in deposition gas mixture changes.

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References

  1. Philos. Mag. A v.48 no.4 Hardness Measurement at Penetration Depths as Small as 20 nm J. B. Pethica;R. Hutchings;W. C. Oliver
  2. Microindentation Techniques in Materials Science and Engineering, ASTM STP 889 Measurement of Hardness at indentation Depths as Low as 20 Nanometres W. C. Oliver;R. Hutchings;J. B. Pethica;B. R. Lawn(ed.)
  3. J. Mater. Res. v.1 A Method for Interpreting the data from Depth-sensing Indentation M. F. Doerner;W. D. Nix
  4. Int. J. Eng. Sci. v.3 The Relation between Load and Penetration in the Axisymmetric Boussinesq Problem for a Punch of Arbitrary profile Sneddon
  5. J. Mater. Res. v.7 An Improved Technique for Determining Hardness and Elastic Modulus Using Load and Displacement Sensing Indentation Experiments W. C. Oliver;G. M. Pharr
  6. Single Crytal Elastic Constants and Calculated aggregate Properties: A Handbook, 2nd ed. G. simmons;H. Wang
  7. J. Am. Cerm. Soc. v.64 G. R. Anstis;P. Chantikul
  8. Contact Mechanics Hertz theory of Elastic Contact K. L. Johnson
  9. Int. J. Solids Structures v.24 no.12 Analysis of Elastic and Plastic Deformation associated with Indentation testing of thin Films on Substrates A. K. Bhattacharya;W. D. Nix