Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Critical Cleaning Requirements for Flip Chip Packages

  • Bixenman, Mike (Critical Cleaning Requirements for Flip Chip Packages) ;
  • Miller, Erik (Critical Cleaning Requirements for Flip Chip Packages)
  • Published : 2000.03.01
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Abstract

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology.

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