Journal of the Institute of Electronics Engineers of Korea TC (대한전자공학회논문지TC)

The Institute of Electronics and Information Engineers (대한전자공학회)
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Vertical Integrated Transformer using Bondwires

본딩와이어를 이용한 수직형 집적 트랜스포머

  • Published : 2000.03.01
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Abstract

In this paper, vortical integrated transformers using bondwires are proposed and characterized for MMIC's (Monolithic Microwave Integrated Circuits) In a wide range of frequencies (1∼20 GHz), where full-wave analysis by the FEM (Finite Element Method) was adopted. The electrical characteristics of the proposed transformers are compared with those of the spiral transformer. We extracted mutual inductances from S -parameters. The vertical transformers using bondwires have not only low insertion loss but also reduce parasitic capacitances and dielectric loss due to their separation from substrates. It can be fabricated easily by used of the modern automatic wirebonding technology. It is expected that the proposed transformers are to improve the performance of MMIC's applied to impedance matching, and phase shifting circuits.

본 논문에서는 본딩와이어를 이용한 수직형 트랜스포머를 제안하고, FEM (Finite Element Method)을 이용한 완전 해석법 (Full-waye analysis)으로 20 GHz 까지 해석하였다 나선형 트랜스포머와 전기적인 특성을 비교하였고, 구해진 S-파라미터로부터 상호 인덕턴스를 추출하였다. 본딩와이어를 이용한 트랜스포머는 낮은 삽입손실을 가지며, 본딩와이어의 대부분이 손실이 없는 공기중에 위치하므로 정전용량 및 유전 손실을 줄일 수 있는 구조이다. 또한, 자동화된 와이어 본딩 장비를 이용하여 쉽게 제작할 수 있다. 본딩와이어를 이용한 트랜스포머는 Impedance matching, Phase shifting등 다양한 범위에 응용되어 MMIC의 성능 향상을 이룰 것으로 기대된다.

Keywords

References

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