대한전자공학회논문지TC (Journal of the Institute of Electronics Engineers of Korea TC)

대한전자공학회 (The Institute of Electronics and Information Engineers)
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수직으로 전이되는 마이크로스트립의 접지용 방사형 스터브

Grounding Radial Stub for the Vertical Microstrip Transition

  • 발행 : 2000.03.01
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⟨ 이전 논문 다음 논문 ⟩

초록

본 논문에서는 고집적 3차원 초고주파 소자 및 모듈에서 발생되는 수직 전이 구조의 효과적인 연결을 위하여 방사형 스터브 (radial stub)를 사용한 접지 방법을 제시하였다. 제안된 구조는 완전 해석법 (full-wave analysis)인 유한 요소법 (finite element method)을 이용하여 해석하였고 제작을 통하여 그 결과를 검증하였다. 해석결과, 2.S~6.3 GHB 주파수 범위에서 반사손실 (return loss) IS dB 이상, 삽입손 실 (insertion loss) 0.5 dB 이하의 특성을 가짐을 확인하였다. 본 해석 결과는 고집적, 소형화를 위한 3차 원 구조를 갖는 초고주파 소자 및 모듈의 공통 접지 연결을 위해 유용하게 사용될 수 있다.

For the microwave high density devices and modules of the 3D configuration, we proposed radial stub for the ground connection. The proposed structure is analyzed by the full-wave analysis of finite element method (FEM) and characterized experimentally. The results show that the return loss is more than 15 dB and the insertion loss is less than 0.5 dB in the frequency range from 2.5 GHz to 6.3 GHz. The proposed grounding scheme will be useful for the ground connection lot the microwave high density devices and module of 3D configuration.

키워드

참고문헌

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