한국정밀공학회지 (Journal of the Korean Society for Precision Engineering)

  • 제17권3호
  • /
  • Pages.47-57
  • /
  • 2000
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  • 1225-9071(pISSN)
  • /
  • 2287-8769(eISSN)
한국정밀공학회 (Korean Society for Precision Engineering)
권호 표지

PC 기반의 다이싱 공정 자동화 시스템 개발

  • 김형태 (한양대학교 대학원) ;
  • 양해정 (한국산업기술대학교 기계설계학) ;
  • 송창섭 (한양대학교 기계공학부)
  • 발행 : 2000.03.01
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초록

In this study, PC-based dicing machine and driving software were constructed for the purpose of automation of wafer cutting process. To automate the machine, hard automation including vision, loading, and software were considered in the development. Auto loading device and vision system were adopted for the increase of productivity, GUI software programmed for the expedient operation. The dicing machine is operated by the control algorithm and some parameters. It is verified that this kind of PC based automation has a great potential compared with the conventional dicing machine when applied to manufacturing some kinds of wafers as a test purpose.

키워드

참고문헌

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