Journal of the Korean Society for Precision Engineering (한국정밀공학회지)

Korean Society for Precision Engineering (한국정밀공학회)
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A Study on Ultraprecision Dicing Machining of Silicon Wafer

실리콘 웨이퍼의 초정밀 절단가공에 관한 연구

  • 이은상 (세종대학교 기계공학부) ;
  • 송지복 (부산대학교 기계공학부, 기계기술연구) ;
  • 김성철 (부산대학교 대학원 정밀기계공학과)
  • Published : 2000.06.01
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Abstract

Recently, a slightest influence to the circuit can be a great damage because the size of semiconductor smaller. It must be controlled the chippingless dicing process and the precision dicing without any damage to tile circuit. In this study, the relationship between chipping effect and the force of dicing was analysed. The rate of chipping was decreased as the farce of dicing decreased. It was also examined that the farce of dicing decreased according to the lower feed rate and higher blade speed. The lower feed rate and the higher blade speed must be controlled to achieve the chippingless process.

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References

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