The Micro Heat Flux Sensor using Electroplated Copper layers

구리 도금층을 이용한 미세 열유속 센서

  • 오석환 (포항공과대학교 기계공학과) ;
  • 전재철 (포항공과대학교 기계공학) ;
  • 김무환 (포항공과대학교 기계공학) ;
  • 이승섭 (포항공과대학교 기계공학과)
  • Published : 2000.07.01

Abstract

New types of the micro heat flux sensor are designed and fabricated using SU-8 and Cu electroplating. And then calibrated under convection environment. The thermal path was made by SU-8 structure and electroplated Cu layers. The bottom surface of the micro heat flux sensor receives the heat flux from the wall, Then the heat flows along the Cu layers and drains out to the environment with producing the temperature difference at the upper layer of Cu. By measuring this temperature difference, the heat flux from the wall can be obtained. The temperature difference is measured by thermopile which is composed of Ni-Cr pairs or Al-chromel pairs. The calibration is accomplished under convection environment because it is most frequent situation. The range of the sensitivity is 0.11~2.02$\mu$V/(㎽/$\textrm{cm}^2$) for the various heat flux and Reynolds numbers.

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References

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