ETRI Journal

Electronics and Telecommunications Research Institute (한국전자통신연구원)
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Statistical Modeling of 3-D Parallel-Plate Embedded Capacitors Using Monte Carlo Simulation

  • Received : 2000.05.18
  • Published : 2001.03.31
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Abstract

Examination of the statistical variation of integrated passive components is crucial for designing and characterizing the performance of multichip module (MCM) substrates. In this paper, the statistical analysis of parallel plate capacitors with gridded plates manufactured in a multilayer low temperature cofired ceramic (LTCC) process is presented. A set of integrated capacitor structures is fabricated, and their scattering parameters are measured for a range of frequencies from 50 MHz to 5 GHz. Using optimized equivalent circuits obtained from HSPICE, mean and absolute deviation is calculated for each component of each device model. Monte Carlo Analysis for the capacitor structures is then performed using HSPICE. Using a comparison of the Monte Carlo results and measured data, it is determined that even a small number of sample structures, the statistical variation of the component values provides an accurate representation of the overall capacitor performance.

Keywords

References

  1. Proc. Int'l. Conf. Exhibition Multichip Modules Integrated Passive Components and MCMs: The Future of Microelectronics Brown, R.;Shapiro, A.
  2. Microelectronics Packaging Handbook Tummala, R.;Rymaszewski, E.J.
  3. HSPICE Users Manual Meta Software
  4. Proc. Electrical Performance of Electronic Packaging Accurate, High Speed Modeling of Integrated Passive Devices in Multichip Modules Poddar, R.;Brooke, M.
  5. Proc. Elec. Comp. Tech. Conf. Electrical and Mechanical Modeling of Embedded Capacitors Rao, Y.;Qu, J.;Wong, C.P.
  6. Proc. Int'l Conf. on Multichip Modules and High Density Packaging Modeling and mixed signal simulation of embedded passive components in high performance packages Sood, A.;Choi, K.L.;Haridass, A.;Na, N.;Swaminathan, M.
  7. IEEE MTT-S Int'l Microwave Symp. Digest v.3 Design of embedded passive components in Low-Temperature Cofired Ceramic on Metal (LTCC-M) technology Fathy, A.;Pendrick, V.;Ayers, G.;Geller, B.;Narayan, Y.;Thaler, B.;Chen, H.D.:Liberatore, M.J.;Prokop, J.;Choi, K.L.;Swaminathan, M.;Meixner, R.
  8. ETRI Journal v.22 no.1 Extraction of Passive Device Model Parameters Using Genetic Algorithms Yun, I.;Carastro, L.;Poddar, R.;Brooke, M.;May, G.;Hyun, K.;Pyun, K.
  9. IEEE Trans. Microwave Theory Tech. v.MTT-22 Equivalent Circuit Models for Three Dimensional Multiconductor Systems Ruehli, A.
  10. IEEE Trans. Cir. Sys. I v.39 Three-dimensional Interconnect Analysis Using Partial Element Equivalent Circuits Heeb, H.;Ruehli, A.E.
  11. IEEE Trans. Advanced Packaging v.22 no.1 Accurate High Speed Empirically Based Predictive Modeling of Deeply Embedded Gridded Parallel Plate Capacitors Fabricated in a Multilayer LTCC Process Poddar, R.;Brooke, M.
  12. IEEE Trans. Microwave Theory Tech v.40 Circuit Models for Three-dimensional Geometries Including Dielectrics Ruehli, A.;Heeb, H.
  13. J. Soc. Ind. Appl. Math. v.11 An Algorithm for Least-Squares Estimation of Nonlinear Parameters Marquardt, D.
  14. J. RF Design v.6 no.2 RF Amplifier Design Program Feeney, R.K.;Hertling, D.R.