반도체 공정에서의 환경친화형 프로세스

Eco-process in a Semiconductor Manufacturing Process

  • 정해도 (부산대학교 정밀기계공학과) ;
  • 김호윤 (부산대학교 정밀기계공학과)
  • Jeong, Hae-Do (Dept.of Precision Mechanical Engineering, Busan National University) ;
  • Kim, Ho-Youn (Dept.of Precision Mechanical Engineering, Busan National University)
  • 발행 : 2001.09.01

초록

키워드

참고문헌

  1. H. Lim, S.S. Kim, K.S. Chung, Influence of Polysilicon Deposition Conditions on the Characteristics of Oxide-Nitride-Oxide Memory Capacitors, J. Korean Phys., Vol. 33, 501, 1998
  2. 정해도, 화학기계적 폴리싱(CMP)에 의한 층간절연막의 광역평탄화에 관한 연구, 한국정밀공학회지, 제13권, 제11호, pp.46-56, 1996
  3. Thomas F.A. Bibby, John A. Adams, Karey Holland, Gerald A. Krulik, Paul Parikh, CMP CoO reduction: slurry reprocessing, Thin Solid Films, 308-309, pp. 538-542, 1997 https://doi.org/10.1016/S0040-6090(97)00496-3
  4. Vilas Koinkar, Reza Golzarian, Qiuliang Luo, Matthew VanHanehem, Jim Shen, Peter Burke, Chemical Mechanical Planarization of copper interconnects using fixed abrasive polishing pad , Proceedings of fifth international CMP-MIC, Santa Clara, U.S.A., March 2-3, pp. 58-65, 2000
  5. Andreas Romer, Timothy Donohue, John Gagliardi, Frauke Weimar, Peter Thieme, Mark Hollatz, STI CMP using fixed abrasive demands, measurement methods and results, Proceedings of fifth international CMP-MIC, Santa Clara, U.S.A., March 2-3, pp. 265-274, 2000
  6. Joseph M. Steigerwald, Chemical Mechanical Planarization of Microelectronic Materials, John Wiley, 1997
  7. Thomas F.A. Bibby, Randy Harwood, Dennis Schey, Kevin Mckinley, Cartesian coordinate maps for chemical mechanical planarization uniformity characterization, Thin Solid Films, 308-309, pp. 512-517, 1997 https://doi.org/10.1016/S0040-6090(97)00435-5
  8. M. fayolle, J.F. Lugand, F. Weimar, W. Bruxvoort, Evaluation of a new slurry-free CMP technique for oxide planarization, Proceedings of third international CMP-MIC, Santa Clara, U.S.A., February 19-20, pp. 128-133, 1998