Journal of the Computational Structural Engineering Institute of Korea (한국전산구조공학회논문집)

Computational Structural Engineering Institute of Korea (한국전산구조공학회)
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Viscoelastic Analysis for Behavior of Edge Cracks at the Bonding Interface of Semiconductor Chip

반도체 칩 접착 계면에 존재하는 모서리 균열 거동에 대한 점탄성 해석

  • 이상순 (한국기술교육대학교 메카드로닉스 공학부)
  • Published : 2001.09.01
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Abstract

The Stress intensity factors for edge cracks located at the bonding interface between the elastic semiconductor chip and the viscoelastic adhesive layer have been investigated. Such cracks might be generated due to stress singularity in the vicinity of the free surface. The domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. The overall stress intensity factor for the case of a small interfacial edge crack has been computed. The magnitude of stress intensity factors decrease with time due to viscoelastic relaxation.

탄성 반도체 칩과 점탄성 접착제층의 계면에 존재하는 모서리 균열에 대한 응력확대계수를 조사하였다. 이러한 균열들은 자유 경계면 부근에 존재하는 응력 특이성으로 인해 발생할 수 있다. 계면 응력상태를 해석하기 위해서 시간 영역 경계요소법이 사용되었다. 작은 크기의 모서리 균열에 대한 응력확대계수가 계산되었다. 점탄성 이완으로 인해 응력확대계수의 크기는 시간이 경과함에 따라 작아진다.

Keywords

References

  1. International Journal of Solids and Structures v.15 Interfacial Stresses in Viscoelastic Adhesive Layers due to Moisture Sorption Weitsman,Y.
  2. International Journal of Solids and Structures v.38 Boundary Element Analysis of singular hygrothermal stresses in a bonded viscoelastic thin film Lee.S.S.
  3. Quality and Reliability Engineering International v.11 Fracture Mechanical Characterization of IC-Device Interface Burger,K.
  4. IEEE Trans. On Components, Hybrids, and Manufacturing Technology v.20 Adhesion Issues in Epoxy Based Chop Attach Adhesives Pearson,R.A.;Liod,T.B.;Azimi,H.R.
  5. 석사학위논문, 한국과학기술원 칩과 리드프레임 사이의 계며파괴인성치에 대한 실험적 고찰 이새봄
  6. International Journal of Solids and Structures v.35 Boundary Element Analysis of the Stress Singularity at the Interface Corner of Viscoelastic Adhesjve Layers Lee,S.S.
  7. Journal of Electronic Packaging v.120 Real-Time Monitoring and Simulation of Thermal Deformation in Plastic Package Zhu,J.;Zou,D.;Liu,S.
  8. IEEE Trans. on Components, Packaging, and Manufacturing Technology-Part C v.20 Sequential Processing Mechanics Modeling for a Model IC Package Wang,J;Liu,S.
  9. IEEE Trans.on Components, Packaging, and Manufacturing Technology-Park A v.20 Ahhesion Issues in Epoxy-Based Chip Attach Adhesives Pearson,R.A.(et al.)
  10. Engineering Fracture Mechanics v.38 Intensity of the Stress Singularity at the Interface Corner of a Bonded Elastic Layer Subjected to Shear Reedy,Jr.(ed.)
  11. International Journal of Solides and Structrues v.37 Connection between Interface Corner and Interfacial Fracture Analysis of an Adhesively-Bonded Butt Joint Reedy,Jr.(ed.)
  12. 대한기계학회논문집 A권 v.22 no.3 점탄성을 고려한 플라스틱 IC패키지의 파손해석 이강용;양지혁
  13. International Journal for Numerical Methods in Engineering v.38 Application of High Order Quadrature Rules to Time Domain Boundary Element Analysis of Viscoelasticity Lee,S.S.;Westmann,R.A.
  14. International Journal of Fracture v.77 Time-Dependent Boundary Element Analysis for an Interface Crack in a Two Dimensional Unidirectional Viscoelastic Model Composite Lee,S.S.
  15. Numerical Fracture Mechanics Aliabadi,M.H.;Rooke,D.P.
  16. The Boundary Element Methods in Engineering Banerjee,P.K.
  17. ASME Journal of Applied Mechanics v.46 Residual Thermal Stresses due to Cool Down of Epoxy Resin Composite Weitsman Y.