Korean Journal of Materials Research (한국재료학회지)

Materials Research Society of Korea (한국재료학회)
권호 표지

Microstructure and Conductivity of Cu-Nb Microcomposites Fabricated by Bundling and Drawing Process

다발체형성과 인발공정에 의해 제조된 Cu-Nb 미세복합재료의 미세조직과 전도도

  • Kwon, Hoi-Joon (Dept. of Metallurgical Eng., Chungnam National University) ;
  • Hong, Sun-Ig (Dept. of Metallurgical Eng., Chungnam National University) ;
  • Jee, Kwang-Koo (Division of Metals, Korea Institute of Science and Technology)
  • 권회준 (충남대학교 금속공학과) ;
  • 홍순익 (충남대학교 금속공학과) ;
  • 지광구 (한국과학기술연구원 금속연구부)
  • Published : 2001.02.01
Download PDF
⟨ Previous Next ⟩

Abstract

The electrical properties of heavily drawn bundled Cu- Nb filamentary microcomposite wires were examined and correlated with the microstructural changes caused by thermomechanical treatments. The cross sectional shape of Nb filaments in wires fabricated by bundling and drawing appear straight or slightly curved. The different shape of Nb filaments is attributed to the break- up and cylinderization of Nb filaments during the bundling process at high temperatures. The resistivity of Cu-Nb microcomposites is predominantly controlled by electron scattering at Cu-Nb interfaces. The decrease of the conductivity below the annealing temperature of $400^{\circ}C$ is due to the increasing contribution of the scattering associated with coherency strains of needle- shaped precipitates. The slight decrease of the resistivity ratio (${\rho}_{295K}/{\rho}_{75K}$) is also due to the precipitation of Nb atoms. The increase in conductivity in Cu-Nb microcomposites at an annealing temperature of 50$0^{\circ}C$ is due to the coarsening and spheroidization of Nb filaments.

다발체형성 제조기술을 이용하여 심하게 인발가공된 Cu-Nb 미세복합재료 전선의 전기적 특성과 열처리에 따른 미세조직 변화와의 관계에 대하여 연구하였다. 다발체형성과 인발공정에 의해 제조된 전선에서 Nb필라멘트 단면방향의 형태는 직선이거나 약간 굽은 형태로 나타났다 Nb필라멘트 형태의 차이는 고온에서의 다발체형성 제조공정중의 Nb필라멘트의 파손과 실린더화에 의해 발생하였다. Cu-Nb 미세복합재료의 비저항은 Cu-Nb 계면에서의 전자 산란에 의해 주로 결정된다. $400^{\circ}C$의 어닐링온도 이하에서 전도도의 감소는 침상형태 석출물의 정합변형율과 관계된 산란의 기여가 증가하기 때문이다. 비저항의 비 ($\rho_{295K}$/$\rho_{75K}$)의 약간의 감소는 또한 Nb원자의 석출 때문이다. 50$0^{\circ}C$의 어닐링온도에서 Cu-Nb 미세복합재료의 전도도 중가는 Nb필라멘트의 조대화와 구형화때문이다

Keywords

References

  1. J. Bevk, J.P. Harbison and J.L. Bell, J. Appl. Phys., 49, 6031 (1978) https://doi.org/10.1063/1.324573
  2. S.I. Hong, M.A. Hill, Y. Sakai, J.T. Wood and J.D. Embury, Acta metall. mater., 43, 3313 (1995) https://doi.org/10.1016/0956-7151(95)00050-6
  3. W.A. Spitzig, F.C. Laabs, H.L. Downing and C.V. Renaud, Materials and Manufacturing Processes, 7, 1 (1992) https://doi.org/10.1080/10426919208947395
  4. W.A. Spitzig, A.R. Pelton and F.C. Laabs, Acta Metall., 35, 2427 (1987) https://doi.org/10.1016/0001-6160(87)90140-4
  5. S.I. Hong and M.A. Hill, Mater. Sci. Eng., 281, 189 (2000) https://doi.org/10.1016/S0921-5093(99)00728-5
  6. C.L. Trybus, L.S. Chumbley, W.A. Spitzig and J.D. Verhoeven, Ultramicroscopy, 22, 315 (1989)
  7. J.D. Verhoeven, L.S. Chumbley, F.C. Laabs and W.A. Spitzig, Acta Metall. Mater., 39, 2825 (1991) https://doi.org/10.1016/0956-7151(91)90100-F
  8. M.C. Savena and B.D. Sharma, Trans. Indian Inst. Matals, 23, 16 (1970)
  9. C. Biselli and D.G. Morris, Acta Metall. Mater., 42, 163 (1994) https://doi.org/10.1016/0956-7151(94)90059-0
  10. C. Biselli and D.G. Morris, Acta Metall. Mater., 44, 493 (1996)
  11. P.W. Knights and P. Wilker, Metall. Trans., 4, 2389 (1973) https://doi.org/10.1007/BF02669380
  12. Y. Komen and J. Rezek, Metall. Trans., 6A, 549 (1975) https://doi.org/10.1007/BF02658413
  13. G.C. Weatherly, P. Humble and D. Borland, Acta Metall., 27, 1815 (1979) https://doi.org/10.1016/0001-6160(79)90072-5
  14. K.R. Karasek and J. Bevk, J. Apple. Phys., 52, 1370 (1981) https://doi.org/10.1063/1.329767
  15. D.D. Pollock, Physics of Engineering Materials, Prentice Hall, Englewood Cliffs, New Jersey, p. 220 (1990)
  16. S.I. Hong and M.A. Hill, Mater. Sci. Eng., A264, 151 (1999) https://doi.org/10.1016/S0921-5093(98)01097-1
  17. A.R. Pelton, F.C. Laabs, W.A. Spitzig and C.C. Cheng, Ultramicroscopy, 22, 251 (1987) https://doi.org/10.1016/0304-3991(87)90069-6
  18. S.I. Hong and M. A. Hill, Acta Metall. Mater., 46, 4111 (1998)
  19. J.D. Verhoeven, H.L. Dowing, L.S. Chumbley and E.D. Gibson, J. Appl. Phys., 65, 1293 (1989) https://doi.org/10.1063/1.343024
  20. V.I. Pantsyrnyi, A.J. Shikov, A.D. Nikulin, A.E. Vorobova, E.A. Dergunova, A.G. Silaev, N.A. Belakov and I.I. Potapenko, IEEE Trans. Magnet-ics, 32, 2866 (1996) https://doi.org/10.1109/20.511473
  21. G. Frommeyer and G. Wassermann, Phys. Stat. Sol. A27, 99 (1975) https://doi.org/10.1002/pssa.2210270112