Journal of Power System Engineering (동력기계공학회지)
- Volume 5 Issue 2
- /
- Pages.71-78
- /
- 2001
- /
- 2713-8429(pISSN)
- /
- 2713-8437(eISSN)
Effects of Bath Compositions and Plating Conditions on Electroless Copper Plating Rate with Sodium Hypophosphite as Reducing Agent
환원제로 차아인산나트륨을 사용한 무전해 동도금속도에 미치는 도금액 조성과 도금조건의 영향
Abstract
Using sodium hypophosphite as reducing agent, bath composition and plating condition of electroless copper plating on plating rate have been studied. The followings were determined as optimum, bath composition;
Keywords