Vacuum Packaging Technology of AC-PDP using Direct-Joint Method

  • Lee, Duck-Jung (Electronic Materials and Devices Research Center, KIST) ;
  • Lee, Yun-Hi (Electronic Materials and Devices Research Center, KIST) ;
  • Moon, Gwon-Jin (Orion electric Co. LTD., R&D Lab) ;
  • Kim, Jun-Dong (Orion electric Co. LTD., R&D Lab) ;
  • Choi, Won-Do (Semiconductor electronic components& electric industry division Ministry of Commerce, Industry & Energy) ;
  • Lee, Sang-Geun (Agency for Technology and Standards, MOICE Electric standards divisions) ;
  • Jang, Jin (Department of physics, Kyunghee University) ;
  • Ju, Byeong-Kwon (Electronic Materials and Devices Research Center, KIST)
  • Published : 2001.12.21

Abstract

We suggested new PDP packaging technology using the direct joint method, which does not need an exhausting hole and tube. The advantages of this method are simple process, short process time and time panel package. To packaging, we drew the seal line of glass frit by dispenser followed by forming the lump, which provide pumping-out path during the packaging process. And, we have performed a pretreatment of glass frit to reduce the out-gases. After which, both front and rear glass plates were aligned and loaded into vacuum packaging chamber. The 4-inch monochrome AC-PDP was successfully packaged and fully emitted with brightness of 1000 $cd/m^2$. Also, glass frit properties for pretreatment condition was investigated by AES and SEM analyses.

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