Korean Journal of Materials Research (한국재료학회지)

Materials Research Society of Korea (한국재료학회)
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A study of CrC Sputtering as an Alternative Method for Cr Electroplating

전해 크롬도금 대체용으로서의 CrC 스퍼터링에 관한 연구

  • Im, Jong-Min (Dept.of Metallurgical Engineering, Inha University) ;
  • Choe, Gyun-Seok (Dept.of Metallurgical Engineering, Inha University) ;
  • Lee, Jong-Mu (Dept.of Metallurgical Engineering, Inha University)
  • 임종민 (인하대학교 공과대학 금속공학과) ;
  • 최균석 (인하대학교 공과대학 금속공학과) ;
  • 이종무 (인하대학교 공과대학 금속공학과)
  • Published : 2002.01.01
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Abstract

Chromium carbide films were deposited on high speed steels using a Cr_3C_2$ target by magnetron sputtering. Effects of the deposition parameters (power, Ar pressure and substrate temperature) on deposition rates and surface roughnesses of the films were investigated. The morphologies of those films were characterized by scanning electron microscopy and atomic force microscopy. The grain size of the samples deposited using dc-power is larger than that using equivalent rf-power. The hardness of the sample increases with increasing rf-power, whereas the elastic modulus nearly does not change with rf-power. The optimum sputter deposition conditions for chromium carbide on high speed steels in the corrosion resistance aspect were found to be the rf-power with small roughness.

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References

  1. B. Meyers, S. Lynn, Chromium elimination, ASM Handbook, Surface Engineering ASM International 5, 925 (1994)
  2. S. Srivastav, A. Jain, J. Vac. Sci. Technol. A, 13,2997 (1995) https://doi.org/10.1116/1.579628
  3. A. Darbeida, J.von Stebut, M.Barthol, P. Belliard L. Lelait, G. Zacharie, Surf. Coat. Techonl., 68-69, 582 (1994) https://doi.org/10.1016/0257-8972(94)90221-6
  4. G. Cholvy, J.L. Derep, M. Gantoris, Thin Solid Films, 126,51 (1985) https://doi.org/10.1016/0040-6090(85)90174-9
  5. M. Pakala, R. Y. Lin, Surf. Coat. Techonl., 81, 233 (1993) https://doi.org/10.1016/0257-8972(95)02488-3
  6. T. Kacsich, M. Neubaer, U. Geyer, K. Baumann, F. Rose, M. Uhrmacher, J. Phys, D, 28, 428 (1995) https://doi.org/10.1088/0022-3727/28/2/027
  7. P.M. Fabis, R.A. Cooke, S. Mclronough, J. Vac. Sci. Technol A 8.3819 (1990) https://doi.org/10.1116/1.576455
  8. V. Guilbaud-Masserreau, A. Celerier, J. Machet, Thin Solid Films, 258, 185 (1995) https://doi.org/10.1016/0040-6090(94)06360-5
  9. D. Wang, T. Oki, Thin Solid Films, 185, 219 (1990) https://doi.org/10.1016/0040-6090(90)90086-S
  10. C. Gaultier, J. Machet, Thin Solid Films, 295, 43 (1997) https://doi.org/10.1016/S0040-6090(96)09164-X
  11. Y. Chiba, T. Omura, H. Ichimura, J. Mater. Res., 8,,1109 (1993) https://doi.org/10.1557/JMR.1993.1109
  12. E. Klar : Metal Handbook (American Society for Metals, Metal Park, Ohio, June) 9th ed. 7, 804 (1984)
  13. K, Isozaki, Y. Hirayama and Y. Imamura: US Patent 4927791 (1990)
  14. M. Wittling, A Bendavid, P.J. MArtin, M. V. Swan, Thin Solid Films, 270,283 (1995) https://doi.org/10.1016/0040-6090(95)06839-2
  15. C. Paturaud, G. Farges, M.C. Sainte Catherine, J. Machet, Thin Solid Films, 347,46 (1999) https://doi.org/10.1016/S0040-6090(98)01417-5
  16. R.W. Armstrong, I. Codd. R. Deuthwaith, and N.J. Petch:Philos. Mag., 7,54 (1962)
  17. J. - E. Sundgren : Thin Solid Films. 128, 21 (1985) https://doi.org/10.1016/0040-6090(85)90333-5