Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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The Improvement of 2nd Level Solder Joint Reliability fur Flip Chip Ball Grid Array

플립 칩 BGA에서 2차 레벨 솔더접합부의 신뢰성 향상

  • Kim, Kyung-Seob (Dept. of Electronics, Yeojoo Institute of Technology) ;
  • Lee, Suk (Dept. of Mechanical Engineering, Chung-Ang University) ;
  • Chang, Eui-Goo (Dept. of Electrical Engineering, Chung-Ang University)
  • 김경섭 (여주대학 전자과) ;
  • 이석 (중앙대학교 기계공학부) ;
  • 장의구 (중앙대학교 전자전기공학부)
  • Published : 2002.04.01
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Abstract

FC-BGA has advantages over other interconnection methods including high I/O counts, better electrical performance, high throughput, and low profile. But, FC-BGA has a lot of reliability issues. The 2nd level solder joint reliability of the FC-BGA with large chip on laminate substrate was studied in this paper. The purpose of this study is to discuss solder joint failures of 2nd level thermal cycling test. This work has been done to understand the influence of the structure of package, the properties of underfill, the properties and thickness of bismaleimide tiazine substrate and the temperature range of thermal cycling on 2nd level solder joint reliability. The increase of bismaleimide tiazine substrate thickness applied to low modulus underfill was improve of solder joint reliability. The resistance of solder ball fatigue was increased solder ball size in the solder joints of FC-BGA.

Keywords

References

  1. Proceeding of Surface Mount International Conference Enhancement of Under-fill Encapsulants for Flip-Chip Technology M. B. Vincent;C. P. Wong
  2. Advances in Electronic Packaging, ASME Fast-Flow Underfill Encapsulant;flow Rate and Coefficient of Thermal Expansion C. P. Wong;M. B. Vincent
  3. International Symposium on Advanced Parkaging Materials An Investigation into the Fracture of Silicon Die used in Flip Chip Application Scott F. Popelar
  4. International Symposium on Microelectronics 2nd Level Reliability Investigation of Memory Package using Power Cycling Test Quan Qi
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  7. McGrow-Hill Fundamentals of Microsystems Packaging Rao R. Tummala