금속기 복합재료의 마찰ㆍ마모 특성에 관한 연구

A Study on the Frictional Abrasion Properties of MMC

  • 이광영 (경상대학교 수송기계공학부 해양산업 연구소) ;
  • 박원조 (경상대학교 수송기계공학부 해양산업 연구소) ;
  • 허선철 (경상대학교 수송기계공학부 해양산업 연구소)
  • 발행 : 2002.11.01

초록

Metal matrix composites had generated a lot of interest in recent times because of significant in specific properties, it was also highlighted as the material of frontier industry because strength, heat-resistant, corrosion-resistant and wear-resistant were superiored. In recent years, the study of metal matrix composite has increased by aluminum alloy. The study is based on the tribological properties of AC4CH that is a part of the mechanical property of metal matrix composites. Metal matrix composite that is produced from matrix material AC4CH and reinforcement SiO$_2$, Al$_2$O$_3$ and TiO$_2$ are added to the metal matrix composite fur strength so binding among the whisker can take place. Each metal matrix composite is produced using the squeeze casting method. To test for tribe a pin-on-disk machine and lubricant is used without paraffine 8.2CST at room temperature which is 40$\^{C}$. As the results of this study, the tribological properties of each specimen are more improved than AC4CH. The variation of coefficient resistance is more stable at the AC4CH and TiO$_2$, but the variation rates are higher at the inanimate binder.

키워드

참고문헌

  1. 대한기계학회지 v.34 no.5 복합재료 응용기술 및 연구 홍창선
  2. Engineering Fracture Mechanics v.3 A Fracture Mechanics Analysis of Fatigue Crack Growth Data for Various Materials N.E.Frost;L.P.Pook;K.Denton
  3. ASTM STP 513 Fatigue Crack Growth Data or Virious Materials Deduced from the Fatigue Lives of Precracked Plates L.P.Pook
  4. Journal of Japan Institute of Light Metals v.44 no.2 Effect of Heat Treatment on the Mechanical Properties of Aluminum Borate Whisker Reinforced 6061 Aluminum Alloy N.Saito;M.Nakanishim;Y.Nishida
  5. Material Science and Engineering A v.102 Role of Silicon Carbide Particles in Fatigue Crack Growth in SiC Particulate Reinforced Aluminum Alloy Composites J.K.Shang(et al.)