Korean Journal of Materials Research (한국재료학회지)

Materials Research Society of Korea (한국재료학회)
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Adhesion of Cu on Polycarbonate Modified by O2/ Ar Plasma Treatment

O2/ Ar 플라즈마 처리에 의해 개질된 폴리카보네이트 기판에서 Cu의 밀착성

  • Park, Jun-Kyu (Department of Materials Engineering, Kyonggi University) ;
  • Kim, Dong-Won (Department of Materials Engineering, Kyonggi University) ;
  • Kim, Sang-Ho (Department of Materials Engineering, Korea University of Technology and Education) ;
  • Lee, Youn-Seoung (Division of Information Communication &Compyter Engineering, Hanbat National University)
  • 박준규 (경기대학교 재료공학과) ;
  • 김동원 (경기대학교 재료공학과) ;
  • 김상호 (한국기술교육대학교 신소재공학과) ;
  • 이연승 (한밭대학교 정보통신컴퓨터공학부)
  • Published : 2002.09.01
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Abstract

In this study, the polycarbonate surface was treated by $O_2$/ Ar gases plasma for the enhancement of adhesion with Cu electrode. From the point of view of hydrophilicity and the functionality, the micro-roughness, new functional groups and oxygen content of the polycarbonate surface were increased by the $O_2$/ Ar gases plasma treatment. The Cu films deposited on the as-received polycarbonate were easily detached while, after the$ O_2$/ Ar gases plasma treatment the adhesive Cu films on polycarbonate could be obtained. These results can be explained that the polycarbonate had a hydrophilic surface with uniform micro-roughness and new functional groups by $O_2$/ Ar gases plasma treatment. Therefore,$O_2$/ Ar gases plasma treatment is a promising method for improvement of adhesion between polycarbonate and Cu electrode.

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References

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