Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
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Reliability Tests of Solder Joints

솔더접합부의 신뢰성 평가(I) - 검사 및 결함의 종류 -

  • 박재현 (포항산업과학연구원 신뢰성평가2팀) ;
  • 김영섭 (포항산업과학연구원 신뢰성평가2팀) ;
  • 정재필 (서울시립대학교 신소재공학과)
  • Published : 2003.06.01
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Abstract

Keywords

References

  1. 더한용접학회， “용접접합편람!· . 1988 . pp.638.
  2. Feinfcous 카달로그.
  3. 더한금속학회， “금속공학실험". 1983. pp.252
  4. Ning-Cheng Lee. “Reflow soldering processes andtroubleshooting SMT. BGA. CSP and Flip chiptechnologies". 2002. pp.197.
  5. IPC - Association Connecting Electronics Industries.IPC-7075. ‘Design and assembly process implementationfor BGAs". 2000.
  6. W. O'Hara and N.C. Lee. “Voiding mechanism inBGAAssembly. ISHM. 1995