References

1. 산업자원부 기술표준원"무연솔더볼”의 신뢰성규격(RS D0015). 2003.
2. JEDEC Solid State Technology Association . JEDICStandard. JESD22-B1l7. “BGA Ball Shear". 2000
3. Ja-Myeong Koo. Dae-Up Kim and Seung•Boo Jung.’‘CHARACTERIZATION AND ANALYSIS OF SHEARTEST WITH TESTING CONDITIONS ON BGAPACKAGE". IWC-KOREA 2002. 慶州. pp.463
4. 박재현， “무연솔더볼의 신뢰성 평가기법 개발!' RIST 과제 결과보고서. 2002.
5. httpllwww.naracelltech.co.kr/BGAPull.htm
6. “노트북의 BGA.CSP 실장사례와 평가방법" 월간전자기술，2월호 . 2000. 41
7. 일본전자공업진홍회. Pb free 솔더에 관한 연구조사 보고서.
8. IEC. IEC 60068-2-14 Basic environmental testingprocedures. Part2. tests N: 'Change of temperature'
9. 일본공업규격. JIS C 0025, “환경시험방법-온도변화시험방법”
10. Sony, 소니기술표준 SS-00254-7, 소니부품설계기춘“무연솔더 표면실장부품의 접합강도 내구성 시험”
11. Hu, J. M., "Knowledge-Based Qualification Testa forElectronic Components in Hiarsh Environments,"Quality and Reliability Engineering International.10:377-390. 1994
12. John H. Lau , Yi-hsin Pao. "Solder joint reliability of BGA, CSP. Flip Chip. and Fine Pitch SMTAssembles". McGraw-Hill. 1997. pp. 153. 201
13. Caulfield. T.. M. Cole. F. Cappo. J. Zitz and J.Beneati. "An Overview of Ceramic Ball and ColumnGrid Array Packaging." in Ball Grid Ar rayTechnology. J. H. Lau. ed.. McGraw-Hill, NewYork, 1995. pp. 131-169
14. Corbin, J. S.. "Fi nite Element Anaysis of Solder BallConnect Structural Design Optimization," IBMJournal of Research and Development. 37:585-596.1993.
15. John H. Lau. Ball Grid Array Technology, Mcgr’aw-hill.1995, 253
16. S. Shetty 외 "Fatigue of CSP interconnect due to cycle bending", Trans. of ASME. Vol. 23, Sep,2001. 302
17. Amkor Technology.“Overview of Reliability Modelsand Data Needs'. Ahmer Syed. 2001
18. 이상용， “신뢰성공학" 형설출판사. 1999. pp. 41
19. EIA, SSB-I-C. 2000. pp.7
20. Bill spink. "Solder Joint Reliability Testing ResultsSummary". MEG-array. 2001
21. 마쪼시다 PWB 신뢰성자료
22. 강춘식，정재필， “마이크로접합". 2002. pp79
23. 대한용접학회， “용접접합편람!· . 1988 . pp.935
24. ESPEC 차달로그
25. KMCC. "Lead free soldering 신뢰성보증기술” 일본 연수자료. 2003