Journal of Welding and Joining

The Korean Welding and Joining Society (대한용접접합학회)
권호 표지

Prediction of Thermal Fatigue Life on $\mu$BGA Solder Joint Using Sn-3.5Ag, Sn-3.5Ag-0.7Cu, and Sn-3.5Ag-3.0In-0.5Bi Solder Alloys

Sn-3.5Ag, Sn-3.5Ag-0.7Cu, Sn-3.5Ag-3.0In-0.5Bi Solder를 이용한 $\mu$BGA Solder접합부의 열피로 수명예측

  • 김연성 (중앙대학교 기계공학부) ;
  • 김형일 (중앙대학교 기계공학부) ;
  • 김종민 (오사카대학교 공학연구소 생산과학) ;
  • 신영의 (중앙대학교 기계공학부)
  • Published : 2003.06.01
Download PDF
⟨ Previous Next ⟩

Abstract

This paper describes the numerical prediction of the thermal fatigue life of a $\mu$BGA(Micro Ball Grid Array) solder joint. Finite element analysis(FEA) was employed to simulate thermal cycling loading for solder joint reliability. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. The results show that Sn-3.5mass%Ag solder had the longest thermal fatigue life in low cycle fatigue. Also a practical correlation for the prediction of the thermal fatigue life was suggested by using the dimensionless variable ${\gamma}$, which was possible to use several lead free solder alloys for prediction of thermal fatigue life. Furthermore, when the contact angle of the ball and chip has 50 degrees, solder joint has longest fatigue life.

Keywords

References

  1. Fundamentals of Microsystems Packaging Rao R. Tummala
  2. Microelectronics v.39 Characterization of chip scale packaging materials M.Amagai https://doi.org/10.1016/S0026-2714(99)00059-1
  3. CSP solder ball reliability Ikemizu
  4. Influence of Process Variables on the Reliability of Micro BGA Pakage Assemblies J.Partridge;P.Boysan
  5. Mate v.98 Shear Fatigue Characteristics of Sn-Ag-Bi, Sn-Ag-Cu and Sn-Ag-In Solder Joint Y.Oguchi;Y.Kariya;M.Otsuka
  6. Mate v.98 Effect of Strain Rate. Hold Time and Third Element on the Fatigue Y.Kariya;H.Kagawa;M.Otsuka
  7. Journal of KWS v.19 no.3 Thermal Fatigye Life Prediction of ㎕BGA Solder Joint Using Sn-37mass%Pb Solder and Sn-3.5mass%Ag Lead -free Solder Young-Eui Shin;Jun-Hwan Lee;Beom-Yong Ha
  8. Transactions of the ASME v.76 A study of the Effect of Cyclic Thermal Stress on a Ductile Metal Coffin;L.F.;Jr;Schenectady.N.Y
  9. IEEE Transactions on Components, Hybrids and Manufacturing Technology v.CHMT6 no.3 Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling Engelmeier;W.
  10. Microelectronics Reliability v.40 review and applicability to chip scale package W.W.Lee;L.T.Nguyen;G.S.Selvaduray https://doi.org/10.1016/S0026-2714(99)00061-X
  11. Solder Joint Reliability of BGA, CSP, Filp Chip and Fine Pitch SMT Assemblies John H.Lau;Yi-Hsin Pao
  12. Journal of KWS v.17 no.1 A Study on the Prediction and Quality Improvement of Joint in IC Package Young-Eui Shin;Jong-Min Kim
  13. ITHERM '98 The Sixth Intersociety Conference A study of the effects of BGA solder geometry of fatigue life and reliabililty assessment Yu;Q;Shiratori;M.
  14. Advanced in Electronic Packaging ASME v.EEP-Vol.4 no.2 Advatages and Disadvantages of TSOP with Copper Gull-Wing Leads John H.Lau;Suresh Golwalkar;Steve Erasmus
  15. Microjoining and Assembly Technology in Electronics '99 Creep Effents on Solder Fatigue and Life Time Prediction K.Maeda
  16. Proceeding of the 1999 IEEE International Symposium on Electronics and Environment K.Habu