한국정밀공학회지 (Journal of the Korean Society for Precision Engineering)

  • 제20권8호
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  • Pages.76-85
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  • 2003
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  • 1225-9071(pISSN)
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  • 2287-8769(eISSN)
한국정밀공학회 (Korean Society for Precision Engineering)
권호 표지

인쇄회로기판으로부터 땜납 제거방법에 관한 연구

A Study for Removing of the Solder from Printed Circuit Boards(PCBs)

  • 발행 : 2003.08.01
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초록

In this paper, a technical method for removing the solder from PCBs has been proposed to simplify the pulverizing process and to get higher quality of materials for recycling of the electronic parts in the Printed Circuit Boards (PCBs). There are several techniques to remove the solder from PCB, such as physical and chemical method, vibration, suction and blowing and so on. Among them, the suction technique turned out the best method by investigation. In the suction method, there are three variables for removing the solder. They are a temperature of the thermal wire, a velocity of moving PCB and a gap between PCB and thermal wire. To find the optimal variables for the system, an experiment has been conducted by a trial and error method. The optimal variables were found $220^{\circ}C$ of temperature, 11.58mm/s of velocity, 10mm of gap (A gap between suction hole and bottom of PCBs is 5mm). The result of the experiment shows that 50% of the solder were removed.

키워드

참고문헌

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